ICFM 2019

2019 International Conference on Functional Materials

September 4-6, 2019 | Tohoku University, Japan

ICFM 2019

2019 International Conference on Functional Materials

Conference Flyer Download

2019 International Conference on Functional Materials (ICFM 2019) will be held in Tohoku University, Japan during September 4-6, 2019.

The conference aims to provide a forum for many of the leading researchers, scientists and engineers from across the field of Functional Materials. We welcome you to join us this year for a program that includes Keynote Speeches, oral presentations and poster sessions. Join others in the scientific community by presenting your research through submitting papers for evaluation. ICFM 2019 promises to be a key opportunity to create new business relationships, learn about cutting edge research and find global partners for future projects.

Authors are invited to submit their contributions that will be reviewed by a committee of prominent individuals who have made significant contributions in the areas of the conferences. Topics are interested but not limited to the following:

- Biomaterials
- Building materials
- Carbon based materials
- Ceramic
- Composites
- Earthquake materials and design
- Environmental friendly materials
- High strength alloys
- Intelligent materials systems
- Iron and steel
- Materials processing and handling
- Metallurgical science

- Metallurgical fundamentals and techniques
- Micro/Nano materials
- New functional materials
- New energy materials
- Non ferrous metal material
- Optical, Electronic, Magnetic materials
- Polymeric materials
- Processing technology for functional materials
- Smart and intelligent materials
- Thin films Mechanical behavior and fracture
- Tool testing and evaluation of materials


Submission Method

More details

Prepare your manuscript

Abstract:4-6 lines of free template; Full paper: 5 pages under the format

Submit online

Submit via http://www.easychair.org/conferences/?conf=icfm2019, you will need an account before submission.


Key Engineering Materials (ISSN: 1662-9795) published by TTP. It will be sent for major indexing, such as EI Compendex and SCOPUS

Important Dates

Conference Dates: September 4-6, 2019

Submission Deadline

July 15th, 2019-extended

Notification Deadline

July 30th, 2019

Registration Deadline

August 10th, 2019